Gigabyte B760M DS3H AX DDR4 Motherboard

GIGABYTE B760M DS3H AX DDR4 (rev. 1.x)

B760M DS3H AX DDR4

 

KEY FEATURE

 

Intel® Socket LGA 1700：Support 13th and 12th Gen Series Processors

Unparalleled Performance：Hybrid 6+2+1 Phases Digital VRM Solution

Dual Channel DDR4：4*DIMMs XMP Memory Module Support

Next Generation Storage：2*PCIe 4.0 x4 M.2 Connectors

M.2 Thermal Guard：To Ensure M.2 SSD Performance

EZ-Latch：PCIe 4.0x16 Slot with Quick Release Design

Fast Networks：2.5GbE LAN & Wi-Fi 6E 802.11ax

Extended Connectivity：Rear USB-C® 10Gb/s, DP, HDMI

Smart Fan 6：Features Multiple Temperature Sensors, Hybrid Fan Headers with FAN STOP

Q-Flash Plus：Update BIOS Without Installing the CPU, Memory and Graphics Card

 

 

GIGABYTE Ultra-Efficient M.2 Thermal Guard

With durability in mind, GIGABYTE provides a thermal solution for M.2 SSD devices. The M.2 Thermal Guard prevents throttling and bottlenecks from high speed M.2 SSDs as it helps to dissipate heat before it becomes an issue.

• 6+2+1 Phases Low RDS(on) MOSFETs

• Premium Choke and Capacitors to improve transient response and minimize oscillation

CONNECTIVITY

GABYTE Motherboards enable the ultimate connection experience with blazing data-transfer speeds through the next generation network, storage, and Wi-Fi connectivity.

 

PERSONALIZATION

GIGABYTE motherboards bundle several useful and intuitive software to help users to control every aspect of motherboard and provide customizable lighting effect with outstanding aesthetics to fit your unique personality.

 

ULTRA DURABLE

GIGABYTE Ultra Durable™ design provides product durability and high-quality manufacturing process. GIGABYTE motherboards use the best components and reinforce every slots to make each of them solid and durable.

 

Specifications
Audio	Realtek® Audio CODEC High Definition Audio 2/4/5.1/7.1-channel * You can change the functionality of an audio jack using the audio software. To configure 7.1-channel audio, access the audio software for audio settings. Support for S/PDIF Out
Chipset	Intel® B760 Express Chipset
Form Factor	Micro ATX Form Factor; 24.4cm x 24.4cm
I/O Connectors
Integrated CPU Graphics
LAN
Memory/Type/Bus/Max.	Support for DDR4 5333(O.C.)/ 5133(O.C.)/ 5000(O.C.)/ 4933(O.C.)/ 4800(O.C.)/ 4700(O.C.)/ 4600(O.C.)/ 4500(O.C.)/ 4400(O.C.)/ 4300(O.C.)/ 4266(O.C.)/ 4133(O.C.)/ 4000(O.C.)/ 3866(O.C.)/ 3800(O.C.)/ 3733(O.C.)/ 3666(O.C.)/ 3600(O.C.)/ 3466(O.C.)/ 3400(O.C.)/ 3333(O.C.)/ 3300(O.C.)/ 3200/ 3000/ 2933/ 2666/ 2400/ 2133 MT/s memory modules 4 x DDR DIMM sockets supporting up to 128 GB (32 GB single DIMM capacity) of system memory Dual channel memory architecture Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in non-ECC mode) Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules Support for Extreme Memory Profile (XMP) memory modules (Please refer "Memory Support List" for more information.)
Misc.
Other I/O Connectors	1 x 24-pin ATX main power connector 1 x 8-pin ATX 12V power connector 1 x CPU fan header 3 x system fan headers 1 x addressable LED strip header 1 x RGB LED strip header 2 x M.2 Socket 3 connectors 4 x SATA 6Gb/s connectors 1 x front panel header 1 x front panel audio header 1 x USB 3.2 Gen 1 header 2 x USB 2.0/1.1 headers 1 x Trusted Platform Module header (For the GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0 module only) 1 x S/PDIF Out header 1 x Q-Flash Plus button 1 x reset button 1 x reset jumper 1 x Clear CMOS jumper
PCI Slots
Processor Support
Raid
RAM Type/Bus/Max.
Socket
Storage Interface
USB Ports	Chipset: 1 x USB Type-C® port on the back panel, with USB 3.2 Gen 2 support 5 x USB 3.2 Gen 1 ports (3 ports on the back panel, 2 ports available through the internal USB header) 2 x USB 2.0/1.1 ports on the back panel Chipset+2 USB 2.0 Hubs: 4 x USB 2.0/1.1 ports available through the internal USB headers
Video Output
Warranty
Weight